Sign up for our newsletter!
Your data will be handled in compliance with our privacy policy.
Your data will be handled in compliance with our privacy policy.
Article published in Chip Scale Review, Jul–Aug, 2017, pp. 38–40.
V Desmaris, R Andersson, A M Saleem • July 1, 2017
Chip Scale Review is a globÂal magÂaÂzine covÂerÂing device and wafer-levÂel test, assemÂbly, and packÂagÂing and covÂers high-denÂsiÂty interÂconÂnecÂtion techÂnoloÂgies includÂing 3D packÂages, MEMS, and othÂer wafer-fabÂriÂcatÂed devices. The magÂaÂzine showÂcasÂes the indusÂtry with excluÂsive ediÂtoÂrÂiÂal conÂtent that includes in-depth techÂniÂcal artiÂcles by indusÂtry techÂnolÂoÂgists, marÂket foreÂcasts and updates from research institutions.
Your data will be handled in compliance with our privacy policy.